Chemical Mechanical Planarization Solutions
Chemical Mechanical Planarization (CMP) is a polishing process, which utilizes a chemical slurry formulation and mechanical polishing process to remove unwanted conductive or dielectric materials on the silicon wafer, achieving a near-perfect flat and smooth surface upon which layers of integrated circuitry are built.
When you work with Cabot Microelectronics Corporation, you'll discover a trusted partner that delivers chemical mechanical planarization (CMP) innovation that reduces your overall cost of ownership. Cabot Microelectronics offers a variety of CMP Slurry and CMP Polishing Pad solutions to the semiconductor industry.
Cabot Microelectronics' mission is to create value by developing reliable and innovative solutions, through close customer collaboration, that solve today’s challenges and help enable tomorrow’s technology.
It is our vision to be a trusted industry partner, providing high-quality solutions with speed and delivering superior cost of ownership.